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Samsung Debuts New Flip Chip LED Packages and Modules
LIGHTimes News Staff
Samsung Electronics Co., Ltd., of Seoul, South Korea, introduced a new line of flip chip LED modules and packages. The new offerings were developed for use in LED bulbs, MR/PAR and downlights and will be available during the second quarter of this year.
“By utilizing an advanced flip chip technology, Samsung has made significant improvements to its LED packages and modules,”said Bangwon Oh, senior vice president, LED strategic marketing team, Samsung Electronics. “Our new Samsung FC and FCOM solutions also strengthen our overall line-up of LED component solutions, further enhancing our market competitiveness.” Samsung’s new flip chip on module (FCOM) solutions and flip chip (FC) LED packages feature flipped over blue LED chips and an adhering phosphor film on each chip. Unlike conventional LED packages that fabricated by dispensing phosphor and then placing a plastic mold over each chip, Samsung says its FC package technology can produce chip-scale size LED packages without any molds. Samsung asserts that its FC and FCOM series can operate at a higher current than that of conventional LED components. The low thermal resistance of both series of flip chips reportedly increases the reliability resulting in higher flux. Thus, the number of packages needed is reduced along with the size of the circuit board compared to traditional LED technology. The design employs an attached cell film on each package for uniform thickness and chromaticity control of MacAdam 3-step ellipses. The new FC and FCOM LED solutions include an LED downlight module, a middle power LED package (LM131A), and a high power LED package (LH141A), all featuring the new Samsung flip chip technology. Samsung’s LM131A and LH141A flip chip packages measure 1.22 x 1.22 mm and 1.4 x 1.4mm, respectively. Samsung points out that excluding a plastic mold allows the two packages to operate reliably at a high current level. Overall, these advantages make them ideal for use in LED lighting applications requiring high light output and a small form factor such as LED bulbs and spotlight products including MRs and PARs. In addition, Samsung says that phosphor film assures color quality that satisfies the MacAdam 3-step. The new FCOM is reportedly compatible with a variety of electrical drivers of different wattages through simply changing the number of FC LED packages. Samsung FCOMs require a circuit with a 1.7x1.7 centimeter form factor for a downlight with 1000lm output and 100lm/W efficacy. Samsung’s FCOMs satisfy the MacAdam 3-step and can support MacAdam 2-step depending on customer needs. Thanks to the superb color consistency of the chips and a color rendering index (CRI) of at least 80. The new Samsung FCOMs also come in a range of correlated color temperature (CCT) options – from 2700K to 5000K. These new LED solutions will be displayed at the Light + Building trade fair in Frankfurt, Germany, March 30 - April 4 (Booth B04 in Hall 6.2).